CAE, the largest EDA category, rose 9.4% to $2.083 billion in Q4, versus $1.761 billion in Q4 2024. Non-reporting IP ...

What makes one AI chip better than another?

Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form ...

LPDDR6; multiphysics for ISO 26262 and complexity; inference stack telemetry; frame rate upscaling.

How next‑gen AI accelerators break past single‑chip limits using advanced IP, high‑speed interconnects, memory interfaces, ...

Limitations—such as latency, bandwidth costs, privacy concerns, catastrophic consequences in the event of failure, and ...

The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.

A convergence of DFT techniques and the proliferation of in-silicon monitors can flag potential failures before they occur.

Insights on implementing a test strategy from bench validation to high-volume that enables a seamless path to scale.

A certificate-based, tamper-proof system can stifle growing grey-market and counterfeit problems. But it requires investment ...

Cloud-based virtualization, real-time data synchronization, and scalable AI/ML deployment can modernize the testing landscape ...

Deploying AI on top of fragmented, siloed, inconsistently formatted data produces fragmented, unreliable results.