Xiaomi has announced the Xring O3 chipset, and it’s a major step up from last year’s O1. It features ARM’s new C1-series cores running at higher speeds, a more powerful graphics unit, and a ...

Xiaomi announced that the upcoming Xiaomi 18 Fold will be powered by the in-house Xring O3 chip, the successor to the Xring O1. What happened to the O2? Well, the O3 is so good, that Xiaomi skipped a ...

First look: Xiaomi has introduced a new mobile processor for its premium devices, expanding efforts to develop technology that powers its smartphones. The Xring O3 is Xiaomi's latest system-on-chip ...

Xiaomi has officially revealed its second-generation flagship chipset, Xring O3. While the new SoC is built on a 3nm TSMC node, official benchmark results show it blowing past every other mobile ...

Xiaomi confirmed the 18 Fold during the launch of its new XRING chips. The company didn't give us a full spec sheet, but it did confirm that the foldable and the upcoming Pad 9 Pro Max will both use ...

The next foldable smartphone from Xiaomi is not going to be called Xiaomi Mix Fold 5, but Xiaomi 18 Fold. The company has officially confirmed this. The device is going to be unveiled in September. It ...

Xiaomi has launched the Xring O3, a system-on-chip that TSMC will manufacture on its 3-nanometre process, according to two people familiar with the matter who spoke to Reuters. The chip pulls ...

Xiaomi founder, chairman and CEO, Lei Jun speaks at an event where he launched new Mix Fold 4 and Mix Flip mobile phones in Beijing on July 19, 2024. MICHAEL ZHANG/gettyimages.com Xiaomi on Monday ...

Xiaomi has unveiled the Xring O3, its latest flagship smartphone chip built on TSMC’s 3nm process. It succeeds the Xring O1 from last year and will power the company’s upcoming Xiaomi 18 Fold and ...

Xiaomi has officially unveiled the XRing O3, its latest custom application processor. The chip is built on TSMC's N3P process node, occupies a 133 mm² die, and packs 24 billion transistors. Xiaomi has ...

Built on a 3nm process, the Xring O3 features a 10-core CPU that delivers up to a 60% performance improvement. It also introduces the 16-core G2-Ultra NX GPU, with graphics performance claimed to be ...

中國智慧型手機製造商小米今天發表新款自主研發晶片「玄戒 O3」（Xring O3）；兩名知情人士透露，這款新晶片將由台積電採 3 奈米製程技術生產。 路透社報導，小米希望透過加強掌控關鍵 ...