Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...
Understanding the thermal performance of integrated circuits, whether they are microcontrollers, FPGAs, or processors, has always been essential to avoid the overheating that can cause circuit ...
December 12, 2011. Mentor Graphics Corp. has announced what it calls the electronic industry’s first combined technology for thermal characterization and simulation with T3Ster® hardware test products ...
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