EMIB facilitates 3D ... thermal, signal, power, and mechanical integrity," said John Lee, vice president and general manager ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next ...

EMIB facilitates 3D-IC ... levels of thermal, signal, power, and mechanical integrity," said John Lee, VP and GM of the electronics, semiconductor, and optics business unit at Ansys. "While customers ...

EMIB facilitates 3D-IC for high-performance microprocessors ... by seamlessly connecting diverse chip types. The flow includes thermal reliability analysis with RedHawk-SC Electrothermal.

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics ... technology used for creating multi-die 3D integrated circuit (3D-IC) systems.

Sonair is debuting at Automate 2025 its ADAR sensor, which is designed to enhance robot safety with 3D soundwave perception.

Furthermore, temperature is proportional to power dissipation, so electrical performance will also depend on thermal conditions. To determine how temperature impacts power integrity/signal integrity ...

3D scanning is fast becoming one of the biggest breakthroughs in this area, and it has already had an impact on industrial manufacturing. It has changed the way manufacturers design, inspect and ...

Insight on Diodes Inc.’s first automotive-compliant 3D linear Hall-effect sensor ... production process is capable of meeting specified design and performance criteria. A standard-compliance ...

the franchise's director remains grateful for the outcome of Sonic's initial, controversial design. Unanimous backlash was the response when the teaser for the first film debuted in April 2019 ...