I went to Oregon to learn how physics can change your putt and your attitude, checking out the big picture on eliminating micro-adjustments.

Cadence has been delivering artificial intelligence (AI)-driven design solutions that support a range of applications, from chiplets and system-on-chips (SoCs) to advanced packaging and 3D-ICs ...

Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process ... Intel Foundry's EMIB technology used for creating multi-die 3D integrated ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured ... multi-die 3D integrated circuit ...

Traditional building development follows a risky model - design, build at full scale, and hope everything works as planned. Sustainable housing prototypes flip this script by creating functioning ...

According to the design team, approximately 75% of the above-ground built area will consist of reused or renovated structures. This approach emphasizes the reuse of existing architectural elements ...

It is easier than ever to produce projects with nice enclosures thanks to 3D printing and laser cutting. However, for a polished look, you also need a labeled front panel. We’ve looked at ...