Samsung and TSMC will join Intel in adopting ASML's latest High NA extreme ultraviolet (EUV) lithography chip fab machines, ASML announced. The three companies also unveiled a new initiative to adopt ...
TSMC and Samsung committed to using ASML’s High NA EUV lithography machines as demand for more advanced chips used in AI grows. Samsung plans to use High NA EUV in 2028 for DRAM memory manufacturing, ...
On September 7, in advance of the SPIE Bacus Conference, ASML and TSMC formed a collaborative industry initiative to drive the transition to 12-inch photomasks, maximizing the value of High NA EUV ...
TSMC is stepping up its technology roadmap to meet surging AI computing demand. According to TechNews, April Li, Global Head of AI and HPC Business Development at TSMC, said at SEMICON Taiwan 2026 ...
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