A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion ... “Power densification is making thermal design a key step in the development of ...

Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include ...

Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced packaging for high-power ... having to painstakingly match their electrical characteristics.

Explore RF directional couplers: essential measurement accessories that transform energy through clever construction ...

The European Commission has adopted the 2025-2030 working plan for the Ecodesign for Sustainable Products and Energy ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next ...

This is where the Nooro Foot Massager, an advanced neuromuscular electrical stimulation (NMES) device, enters the ...

The Edward E. Whitacre Jr. College of Engineering at Texas Tech University has been awarded $3.75 million by the Defense ...

Advanced automotive materials, including high-strength steels, aluminum, magnesium, carbon fiber composites, and advanced ...

Micro-sized servo drives are redefining possibilities, achieving unmatched performance while saving weight and space.

Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs to meet soaring demands for performance and memory bandwidth. TSMC's ...

"As we continue to transform our portfolio to become a more focused, higher growth electrical company, we are excited to welcome the Electrical Products Group team to nVent," said nVent Chair and CEO ...