i.e. Furnace ALD and in 2024 introduced PEALD. Other than these, ACM introduced Track and PECVD in 2022. Track helps coating, baking of semiconductors and PECVD uses plasma to deposit thin film of ...

Q1 2025 Earnings Call Transcript May 8, 2025 Operator: Good day, ladies and gentlemen. Thank you for standing by. And welcome ...

Timothy Archer; President, Chief Executive Officer, Director; Lam Research Corp Douglas Bettinger; Chief Financial Officer, Executive Vice President; Lam Research Corp Good afternoon, and welcome to ...

The company’s products include wafer processing deposition systems for atomic layer deposition (ALD), epitaxy, silicon carbide, plasma enhanced chemical vapor deposition (PECVD), and vertical ...

low-pressure thermochemical deposition LPCVD and atomic horizontal deposition ALD and other thin film equipment, silicon and germanium silicon epitaxial EPI equipment, a new generation of plasma ...

and ALD (atomic layer deposition) thin film equipment, silicon and germanium-silicon epitaxial EPI equipment, a new generation of plasma source PECVD equipment and electron beam detection equipment, ...