Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel ...

A Korean research team has developed a novel thermoelectric material and generator (TEG) that leverages sponge-like carbon ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking ...

Despite persistent supply chain issues and other challenges, long-term trends favor composites in new platforms. Meanwhile, ...