A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...
Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...
Engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous ...
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