IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

Direct Insight is to offer KaRo’s 27 x 27mm system on module that pairs a 1.2GHz dual-core Arm Cortex-A35 processor with 1Gbyte of LPDDR4, 4Gbyte of eMMC flash and an NPU. Called QSMP-23, “this solder ...

TEL AVIV, Israel--(BUSINESS WIRE)--Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, will showcase live demos of its latest SoMs at Embedded World 2025, held ...

Innovations in embedded modules are on full display at embedded world 2024. Modules, including computer-on-modules (COMs), system-in-packages (SIPs) and system-on-modules (SOMs), are designed to ...

Aimed at applications that need to transition from a microcontroller (MCU) to a microprocessor (MPU) to handle increased processing requirements, Microchip Technology Inc. has expanded its MPU-based ...

The previous articles of this series have discussed the innovation and evolution of the integrated-circuit industry and how system-in-package (SiP) devices fit into the market. In the first article, ...

Module Type Package is an exciting technology that stands to make the integration of machines into a higher-level DCS, SCADA or MES significantly easier and faster. It is an open standard and ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...