2. Points of Failure: BGA Solder Joints The following is a list of some points of failure associated with FPGAs in BGA packages: (1) the junction between the FPGA package and the solder ball, (2) the ...

Add some ball grid array (BGA) chips into the mix, where the solder joints are not visible by design, and inspection is more a leap of faith than objective proof of results. How it works.

NASA Dryden has built a new Solder Joint Health Monitoring Testbed ... integrated circuits (ASICs); and exemplary packages are grid arrays such as plastic-type ball grid arrays (PBGAs, PGAs, BGAs), ...

Its unique flux formulation enhances solderability and wettability, delivering strong, stable solder joints even under challenging ... and ensuring consistent solder ball performance.