Opportunities lie in AI/ML storage, local semiconductor production, and new technological solutions for endurance limitations. The Middle East and Asia-Pacific lead growth forecasts.Dublin, Jan. 21, ...
CEO Andy Hsu will introduce new applications and variations for 3D NAND flash and 3D DRAM, including a new AI application called "Local Computing", drastically increasing AI chip performance to a new ...
The late 1990s saw the widespread introduction of solid-state storage based around NAND Flash. Ranging from memory cards for portable devices to storage for desktops and laptops, the data storage ...
Combining Industry’s lowest-power high-speed Octal flash device, incorporating leading embedded AI processing with Renesas’s Dynamically Reconfigurable Processor (DRP) Technology and targeted at ...
Zacks Investment Research on MSN
TER's memory test sales hit $128M: Is the growth thesis strengthening?
Teradyne TER is benefiting from the growing demand for memory test solutions, particularly driven by advancements in AI ...
In 2024, the semiconductor sector faces pivotal shifts as demand for silicon wafers varies and global equipment spending adapts. At the forefront of these changes are innovations in high-performance ...
Investors mull over a mix of factors, but analysts cite target prices that are mostly higher Read more at The Business Times.
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
Semiconductor legend and scholar Simon Min Sze was commemorated in Taiwan by his students, friends, colleagues, and semiconductor industry celebrities including executives from TSMC, UMC, Macronix, ...
Applied Materials' expanding HBM, NAND and advanced packaging tools contrast with ASML Holding's EUV-led shift in ...
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