An agreement to secure supply for Qualcomm Technologies’ new generation of RF filters After multiple years of collaboration with Qualcomm Technologies, Soitec has concluded an agreement to bring POI ...

LOS GATOS, CA / ACCESSWIRE / July 2, 2024 / Atomera Incorporated (NASDAQ:ATOM), a semiconductor materials and technology licensing company, today announced the availability of an MST® solution to ...

Despite the current downturn in telecommunications, Taiwan’s PCB (printed circuit board) concerns have begun to develop substrate for RF (radio frequency) modules to diversify their product lines and ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

MIGDAL HAEMEK, Israel, Sept 10, 2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the production of Wi-Fi 7 RF front-end ...

IXYS Colorado announced its new series, the IXZ631, an integrated high-speed gate driver and MOSFET RF modules featuring very low insertion inductance and isolated substrate. The product is designed ...

DUBLIN--(BUSINESS WIRE)--The "Broadcom AFEM-8072 - Mid and High Band LTE RF Front-End Module (FEM) Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering. This report ...

In the past two columns we have looked at the possible side effects of adding a shield to our PCBs. First we showed how to calculate the lowest frequency resonance, backed up with actual data that ...

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

Avago Technologies has announced a complete RF 802.11 a/b/g/n front end module. Operating in the 2.4 GHz and 4.9-5.9 GHz frequency bands, the fully integrated AFEM-9601 multi-function module is ...