Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

The new arm will focus on three areas: packaging intelligence, supply chain optimisation and next-generation materials.

Fibre-based packaging, including moulded pulp and paper structures, is emerging as a scalable plastic alternative as ...

Secondary packaging is increasingly becoming a darling of companies’ smart technologies and sustainability goals.

Atlantic Packaging, the largest privately held industrial packaging company in North America, has launched New Earth Ventures ("NEV"), a dedicated innovation and investment arm focused on building the ...

Qnity Electronics, Inc. Q sits in the middle of a fast-moving artificial intelligence (AI) hardware buildout that is reshaping materials demand across the semiconductor value chain. The company’s ...

Automotive radar systems are typically composed of an antenna, front-end radar sensor and back-end signal processor. Current state-of-the-art automotive radar systems make use of the latest integrated ...

Google may use Intel Foundry’s EMIB packaging for TPUv8e, boosting Intel’s AI chip ambitions and reshaping advanced ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

WEST LAFAYETTE, Ind. – A large-scale manufacturing process to improve food packaging and keep groceries fresher longer has received top honors at one of the world’s largest technical conferences for ...

Explore packaging careers at Interpack 2026 with tours, forums, and hands-on demos for students and young professionals ...

Gain Real-World Experience: Two blocks of cooperative education provide you with hands-on, full-time paid work experience in the packaging science industry ...