The new arm will focus on three areas: packaging intelligence, supply chain optimisation and next-generation materials.

TSMC is plotting another big move in its American push, this time with plans to manufacture some of its most advanced chip packaging tech in the US to loosen its dependency on Taiwan. The firm’s ...

ProPak China 2025, the leading processing and packaging trade show in Asia, will return to Shanghai’s National Exhibition and Convention Center (NECC) from 24 to 26 June 2025. The event, marking its ...

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...