From predictive maintenance to excursion monitoring, AI is redefining yield management in multi-die assembly. When a ...

The joint solution combines Chef's AI focus and flexibility with Proseal's tray sealing machines and packaging solutions to ...

Packaging is becoming more and more challenging and costly. Whether the reason is substrate shortages or the increased complexity of packages themselves, outsourced semiconductor assembly and test ...

The supply chain starts with raw materials and ends up with the finished products that get delivered to your store and in the hands of the consumer. Products make numerous stops along the supply chain ...

Programmable, smart devices coupled with new approaches and new standards are changing safety from a static add-on to a dynamic partner in packaging machine productivity. Safety in the packaging ...

Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand Process Technology ...

Dr. Lee Chunheung, recognized as one of the top experts in semiconductor packaging, has been appointed to lead the Korean ...