Electronic designers need greater integration densities and faster data transfer rates to meet the increased performance requirements of technologies like 5G/6G, autonomous driving, and artificial ...
Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) ...
PITTSBURGH, July 23, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain ...
Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Ansys' certified semiconductor solutions will enable Faraday to shorten design cycles of 2.5D/3D-ICs and ensure designs meet signal integrity and performance goals Faraday Technology Corporation will ...
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