Semiconductors are the essential component fueling the growth of industries such as automotive, renewable energy, communications, information technology, defense, and consumer electronics. The rise of ...

Artificial Intelligence has become a pervasive technology that is being applied to solve today’s complex problems, especially in the areas involving exponentially large amounts of data, their analysis ...

Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

The EDA leader has generated over $500M to date in AI tools and technologies. Now a new data analytics solution applies data management, curation, and analysis across the entire pipeline of chip ...

Although the term DigRF may lead to initial impressions of a digital signal somehow integrated into an RF signal path, this is not the case. DigRF is a published standard that describes a digital ...

Moore's Law, which predicts the growth of chip computing power, is still valid but has been slowing down. The micronization of the semiconductor process could no longer hold on to the former pace of ...

Cadence rolled out its latest AI-powered electronic design automation (EDA) platform called Verisium, which promises to ease the amount of time and resources that chipmakers put into the verification ...

The estimated revenue of Taiwan's IC design industry in 2022 totalled at a commanding US$40 billion. The sector has proven itself to be eminently high-yielding with an enviable average profit margin ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...