A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...
BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that ...
Synopsys chose the International Test Conference to highlight two significant initiatives: defect-detection enhancements in TetraMAX ATPG through slack-based cell-aware test capability, and a new STAR ...
Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
How do engineers deliver 10 defective parts per billion (Dppb) to auto makers if they only screen 1 million parts per year? Answer: By comprehending failure mechanisms and proactively screening for ...
The IEEE Computer Society Technical Committee (TC) on Test Technology will hold a workshop on current and defect-based testing. It will take place April 27, 2003 at the Napa Valley Marriott, Napa ...
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