Business Wire

Onto Innovation Debuts Sub-surface Defect Inspection for Advanced Packaging

Onto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) ...
AZoOptics

Fast 3D Defect and Surface Roughness Measurement for Manufacturing Quality Control

Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...
Electronic Design

Inspection systems address ‘middle-end’ semiconductor processes

Packaging advances are driving innovation at KLA-Tencor, which in May announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for ...
Nature

Optical Surface Defect Inspection and Imaging Techniques

Optical surface defect inspection and imaging techniques are pivotal to ensuring high-performance outcomes across a myriad of applications including semiconductor manufacturing, precision optics, and ...
Semiconductor Engineering

Increasing Semiconductor Device Reliability Requires Adding More Wafer Inspection

Some industry sectors such as automotive and medical continue to push for higher and higher reliability levels; however, many fabs are having difficulties achieving them. Current inspection regimes ...
Semiconductor Engineering

Criticality of Wafer Edge Inspection and Metrology Data to All-Surface Defectivity Root Cause and Yield Analysis

As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...